Teledyne FLIR Introduces Lepton 3.1R Radiometric Thermal Camera Module for Integrators

The 3.1R model maintains the same compact and low-power form factor that made the Lepton family of thermal camera modules the best-selling in the world for mobile, small electronics, and uncrewed systems.

“The revolutionary Lepton was the world’s first thermal micro camera module integrated into millions of devices from ruggedized smartphones to drones,” said Mike Walters, vice president, product management, Teledyne FLIR. “Lepton 3.1R can now propel advancements in cost-saving and lifesaving unattended products ranging from early fire monitoring of critical machinery, electrical switchgear, and data centers to IoT products for smart factory, occupancy monitoring, smart homes, smart appliances, and even elderly care applications.”

The Lepton 3.1R is a drop-in enhancement for existing Lepton-based products. It incorporates the same visual object and space perception interface (VoSPI), inter-integrated circuit (I2C), and electrical and mechanical form and fit as predecessor Leptons to simplify development. Furthermore, Lepton continues to be the lowest-cost focal plane array (FPA) based thermal sensor on the market.