Teledyne FLIR Boosts Boson+ Infrared Thermal Camera Performance with Embedded Software Upgrade

Teledyne FLIR, part of Teledyne Technologies Incorporated, announced the nextgeneration embedded software for the ITAR-free Boson+ thermal camera module, delivering high performing uncooled thermal imaging technology for defense, firefighting, automotive, security, and surveillance applications.

Featuring thermal sensitivity of ≤20 mK, Boson+ has been upgraded to provide even sharper thermal imagery and improved spatial filtering. Continuously improved thermal performance and proven market-leading reliability make Boson+ the low-risk integration choice for unmanned platforms, security applications, handhelds, wearables, and thermal sights.

Boson+ interfaces seamlessly with the new Teledyne FLIR AVP, an advanced video processor that powers Prism AI and computational imaging at the edge. The AVP, built on the latest Qualcomm QCS8550, efficiently runs Teledyne FLIR Prism AI software providing detection, classification, and target tracking. To improve data fidelity and enhance decision support, it also operates Prism ISP algorithms including super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local-contrast 1/2 enhancement, and noise reduction.