RIEGL to Exhibit and Present at SPAR 3D Expo & Conference 2018!

RIEGL will be exhibiting at Booth 501 during the conference. Be sure to stop by our booth to learn about the latest developments in RIEGL Waveform-LiDAR technology and how we can help you and your business!

Meet with our team of RIEGL experts at our booth throughout the week and see our RIEGL instruments in person: the RIEGL VZ-400i, the RIEGL VZ-2000i, the RIEGL VMX-2HA, the RIEGL miniVUX-1DL, and the RIEGL miniVUX-1UAV, integrated on a DJI-M600 with the RIEGL Integration Kit 600.

The VZ-400i is a cutting-edge, ultra high performance 3D terrestrial laser scanning system that is redefining productivity through the combination of future-oriented, innovative processing architecture and internet connectivity with RIEGL’s latest waveform processing LiDAR technology.

The VZ-2000i is a long range, very high speed 3D terrestrial laser scanning system that combines proven user friendliness in the field with fast and highly accurate data acquisition.

The VMX-2HA is a high speed, high performance dual scanner mobile mapping system which provides dense, accurate, and feature-rich data at highway speeds. With two million measurements and five hundred scan lines per second, this turnkey solution is ideally suited for survey-grade mobile mapping applications.

The miniVUX-1DL is a downward-looking LiDAR sensor for unmanned laser scanning with a special design that is tailored to meet the needs of corridor mapping tasks through its downward looking capability, its optimized field of view, and its small size.

The miniVUX-1UAV is a user-friendly and cost-efficient miniaturized LiDAR sensor for unmanned laser scanning used to acquire survey-grade measurement data through the use of remotely piloted multi-rotor, rotary-wing, or fixed-wing UAV’s for a variety of applications. The miniVUX-1UAV will be on display while integrated into a DJI-M600 with the RIEGL Integration Kit 600.

In addition to our exhibition at SPAR 3D 2018, we will be presenting a workshop at the conference!

Join our team of RIEGL experts on Tuesday, May 5 from 9:30 AM-12:00 PM in Room 304A on the third level at the Anaheim Convention Center to learn about acquisition tips on VZ-400i workflows, RiSOLVE and forensic scanning, advanced processing in RiSCAN PRO, exporting to RiPROCESS, and more!

RIEGL is looking forward to a successful conference and to welcoming you to the SPAR 3D Expo & Conference 2018!