RIEGL to attend and exhibit at Autodesk University 2019

Autodesk University 2019 will be taking place from November 19-21, 2019, at the Sands Convention Center in Las Vegas, Nevada.

RIEGL will be exhibiting at Booth INF202 during Autodesk University 2019. Be sure to stop by our booth to learn about the latest developments in RIEGL Waveform-LiDAR technology, such as our fast-TLS solutions and how they can help you and your business needs.

Stop by our booth throughout the week to see our fast-TLS scanner, the RIEGL VZ-400i, on display,

The VZ-400i is a 3D laser scanning system which combines an innovative new processing architecture, internet connectivity, and a suite of MEMS sensors with RIEGL’s latest waveform processing LiDAR technology.

Please stop by the booth for a personal in-booth demonstration with our state-of-the-art instrument.